TAK miniature piezo modules

Our line of fully-integrated plug-and-play high-bandwidth piezo actuation and sensing modules are designed to unlock creative solutions and accelerate prototyping for a wide range of applications and user experiences.

FULLY INTEGRATED - The patent-pending TAK module architecture combines a state-of-the-art high-stroke piezoelectric actuator/sensor together with a miniature boost converter and piezoelectric driver into a single compact device.

encapsulated TDK PowerHap piezoelectric element
fully enclosed Boréas BOS1921-based high-voltage drive electronics
sealable, precision enclosure

PLUG AND PLAY - By including the high-voltage drive electronics inside the case, the TAK module is inherently safe and ready to use out of the box.

3.3 - 5.0V supply
standard I2C/I3C communication interface
6-wire cable and integrated FPC options

HIGH-BANDWIDTH DYNAMIC INTERACTIONS - Combining the Boréas BOS1921 piezoelectric driver with TDK PowerHap actuators provides an integrated solution to deliver high-fidelity, real-time haptic feedback for a wide range of applications.

sub-300µs startup / sub-30µs active latency
8-1024 ksps streaming + onboard waveform synthesizer
20 or 40 µm actuation options
3-4N blocking force
<0.25mN force-sensing resolution

ROBUST MINIATURE PACKAGING - During the manufacturing process we are able to compensate for the relatively large tolerance of the actuators to provide a high-precision, ready-to-use solution.

precisely controlled tolerance in the actuation/sensing axis (sub 20µm standard)
optional environmental sealing
multiple standard variants & custom options

AVAILABILITY & ORDERING - The first batch of prototype units are currently available for early-access partners, while the first round of production TAK modules will be available in early Spring 2025. To join the early-access program or to inquire about purchasing production units, simply email us at info@bergsonnelabs.com or fill out the form below

TAK miniature piezo modules

FULLY INTEGRATED - The patent-pending TAK module architecture combines a state-of-the-art high-stroke piezoelectric actuator/sensor together with a miniature boost converter and piezoelectric driver into a single compact device.

encapsulated TDK PowerHap piezoelectric element

fully enclosed Boréas BOS1921-based high-voltage drive electronics

sealable, precision enclosure

PLUG AND PLAY - By including the high-voltage drive electronics inside the case, the TAK module is inherently safe and ready to use out of the box.

3.3 - 5.0V supply

standard I2C/I3C communication interface

6-wire cable and integrated FPC options

HIGH-BANDWIDTH DYNAMIC INTERACTIONS - Combining the Boréas BOS1921 piezoelectric driver with TDK PowerHap actuators provides an integrated solution to deliver high-fidelity, real-time haptic feedback for a wide range of applications.

sub-300µs startup / sub-30µs active latency

8-1024 ksps streaming + onboard waveform synthesizer

20 or 40 µm actuation options

3-4N blocking force

<0.25mN force-sensing resolution

ROBUST MINIATURE PACKAGING - During the manufacturing process we are able to compensate for the relatively large tolerance of the actuators to provide a high-precision, ready-to-use solution.

precisely controlled tolerance in the actuation/sensing axis (sub 20µm standard)

optional environmental sealing

multiple standard variants & custom options