TILES

OVERVIEW -  Tiles are miniature plug-and-play prototyping modules designed specifically for the rapid development of product-scale mechatronic systems.  By integrating all of the required components and handling the detailed fine-pitch layout, we enable system designers to focus on the functionality of the overall product while decreasing risk, reducing prototyping turnaround, and accelerating time to market.

DIMENSIONS - Unless otherwise noted, the standard tile is built as an ultra-thin 4.0 x 4.0 mm PCB with up to ten 0.4 x 0.7 mm SMD pads running along two edges.  

CATEGORIES - Tiles are currently divided into four main categories. CORE for embedded processing, POWER for battery charging and voltage regulation, SENSE for input sensors, and ACTION for output drivers, as listed below and detailed on the tile-specific subpages.

BETA PROGRAM - join our beta developer network to get early access to new modules, help to refine our offerings, and influence future developments. To secure a spot, please send us an email at info@bergsonnelabs.com.or fill out the contact form at the bottom of the page.

CORE

  • Core.W

    ultra low power embedded processor with integrated 2.4GHz wireless
    STM32WBA55 100MHz Cortex M33
    1MB flash, 128kB SRAM, 512B OTP
    integrated 2.4GHz wireless
    BLE, Thread, Matter, Zigbee
    14 GPIO, including 2xI2C, SPI
    2.5Msps 12-bit ADC

  • Core.U1

    minimalist USB interface
    STM32L422 80MHz Cortex M4
    128kB flash, 40kB SRAM
    USB, I2C, SPI
    2.5Msps 12-bit ADC
    ultra-low-power 1.7-3.6V supply
    10-pad package

  • Core.U2

    expanded I/O USB
    STM32L422 80MHz Cortex M4
    128kB flash, 40kB SRAM
    USB, I2C, SPI
    2.5Msps 12-bit ADC
    ultra-low-power 1.7-3.6V supply
    20-pad package

SENSE

  • Sense.I

    9-DOF digital inertial measurement
    TDK ICM20948 16-bit digital IMU
    ±2/4/8/16g acceleration
    ±250/500/1000/2000 deg/s gyro
    ±4900µT magnetometer
    I2C / SPI interface
    1.8V supply

  • Sense.A1

    high-bandwidth digital triaxial accelerometer
    ST IIS3DWB
    ±2/4/6/18g 16-bit triaxial accelerometer
    DC-6kHz bandwidth
    I2C/SPI digital interface
    1.1mA @ 2.1-3.6V

  • Sense.P

    24-bit absolute pressure sensor
    ST LPS22HH
    260-1260 hPa range
    0.5hPA accuracy
    DC-200Hz
    12µA @ 1.7-3.6V

ACTION

  • Drive.H

    haptic LRA/ERA driver
    TI DRV2605
    I2C, PWM, analog
    2.5-5.5V supply

  • Drive.P

    miniature piezoelectric driver
    Boréas BOS1921
    max 190V peak-to-peak output
    high-res. dynamic force sensing
    I2C/I3C interface
    integrated waveform synthesizer
    3-5.5V supply, 1.8-5V digital I/O

  • Drive.D

    dual h-bridge driver for inductive loads
    3Peak TPM8837C
    1A, 17V max inductive load
    1.8-5V logic supply

POWER

  • Power.1

    single-cell Li-Ion/Li-Po battery charger with I2C monitoring and a 1.8V regulated output supply
    500mA 1-cell charge controller
    I2C interface
    1.8V 100mA regulated output
    active-low disable

  • Power.2

    dual-cell Li-Ion/Li-Po boost charger
    MPS MP2672
    4.0-5.75V supply input
    up to 2A charge current
    I2C control/monitor interface

STAY INFORMED